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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
New Equipment | Solder Materials
16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny
Automated Cartesian coordinate dispensing system for high throughput applications involving adhesives and sealants.
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
New Equipment | ESD Control Supplies
10ft long ground cord terminated by a banana plug and low-profile 10mm male snap. Conveniently attaches to other surfaces with a 10mm female snap. Low-profile 10mm male snap High strength tinsel wire Banana plug terminated Black UL listed
New Equipment | ESD Control Supplies
15ft long ground cord terminated by a banana plug and low-profile 10mm male snap. Conveniently attaches to other surfaces with a 10mm female snap. Low-profile 10mm male snap High strength tinsel wire Banana plug terminated Black UL listed
New Equipment | ESD Control Supplies
10ft long ground cord terminated by a banana plug and a dual-port. Accepts two banana plug terminated wrist straps. 10mm male snap on the bottom of the dual-port makes for easy attachment to other surfaces. Dual-port to accept two banana plug te
New Equipment | ESD Control Supplies
15ft long ground cord terminated by a banana plug and a dual-port. Accepts two banana plug terminated wrist straps. 10mm male snap on the bottom of the dual-port makes for easy attachment to other surfaces. Dual-port to accept two banana plug te
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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SMT Nozzle 1120 (Original lettering) for GSM Flex jet2/3 Genesis machine chip mounter MODEL SPECIFICATION Flex jet 120F/125F/234F/340F/160F/360F Flex jet
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