New SMT Equipment: loctite glue temp (Page 1 of 1)

Adhesives & Dispensers

Adhesives & Dispensers

New Equipment | Dispensing

Adhesives and dispensing products from Loctite, Chemtronics, Circuit Works, Techspray, Jensen, Steinel. Adhesives Bottles Conformal Coatings Dispenser Systems Epoxies Glue Guns & Sticks Light Cure Systems & Supplies Needles & Syringes Sili

Kimco Distributing

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

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