SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Solder Materials
Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types
New Equipment | Solder Materials
An alcohol based, halide free, no-clean liquid flux designed specifically to have a very wide process window for wave solder applications.Flux, No Clean Liquid, NC-264-5, (4 Gallon Case)
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
New Equipment | Wave Soldering
Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D
Specialty Solder Products for SMT Assembly- Solder Paste (No-Clean, Water Wash), Solder Spheres, Fluxes, Preforms, Wire, Ribbon.
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
New Equipment | Solder Materials
To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporati
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