The SDV-111 series led signs are versatile and instant to run. The main features include: - 16 colors with 7 English and European character fonts - large storage of 100 pages or 7,000 characters - 24 eye-catching display effects - built-in message d
New Equipment | Cable & Wire Harness Equipment
Overview The PreFeeder 1100 is a solid and reliable benchtop electrical prefeeding machine for cable reels up to 20 kg (44.4 lbs.) and 457 mm (18") in diameter. This low-cost unit is ideal for feeding wires and cables off small to medium sized spoo
New Equipment | Test Equipment
Behlman's BL series AC Power Supply / Frequency Converter / Inverter, requires just 88.9mm (3.5") of rack height, and weighs just 15.2kgs (40 pounds), yet it delivers 1350VA of quality AC power. In the BL series, you'll find the quality features you
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
New Equipment | Cable & Wire Harness Equipment
Overview The powerful EcoStrip 9320 processes round cables up to 9 mm (0.35") O.D. and flat ribbon cables up to 13 mm (0.51") width with pull-off lengths up to 110 mm (4.33") on the right end (leading end) and 45 mm (1.77'') on the left end (traili
New Equipment | Wave Soldering
The modular system for medium production volumes, to be soldered in ambient atmosphere or with local nitrogen inertion of the solder bath. With the wave soldering system PowerWave, SEHO consequently realized a machine concept that offers a remarkab
Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th
===================================================================== Extended Temperature Range Low power consumption/Small size boards Resist vibrations/humidity Reliability/Versatility Technical Support / Customer Care Speed - up your produc
