New Equipment | Solder Materials
Proposal Pro Contra Vaporphase OT2 SCAN-Ge XF3+ Large melting range Anti-Tombstoning Dull solder joints
Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time
High-speed High-precision Universal High-end SMT Screen Printer With the speed of the Yamaha mounters you need reliable, high speed solder paste printing. Built on the same YSP monocoque frame as Yamaha’s mounters the Yamaha YSP printer provides th
The YCP10 is developed as the successor to the YCP II, and offers high-performance printing in a compact body that is also cost effective. It has the versatility to handle large circuit boards, as well as a wide variety of stencil sizes despite its c
New Equipment | Design Services
Our design services – the total package. At i3, we are the premier supplier of leading-edge PCB and semiconductor package designs. We maintain a highly skilled team of design engineers with more than 170 years of collective experience in the desi
New Equipment | Wave Soldering
Simplified design and easy operation make Delta 3 a high-reliability favorite. EasyUse, Delta 3’s user-friendly operator interface, displays alarms and setpoint values where they occur, making it simpler to prevent in-process problems. Delta 3 Wave
Boiler and Pressure Vessel Steel Plate Steel-exporter()zzjygt.com Skype: jy-steel-plate 1. Steel Standards: GB/T713, ASTM, GB713, JISG3103, JISG3115, JISG3118, JISG3119, JISG3124, GB6645, GB3531, DIN17155, ASME, EN10028-2, EN10028-2, NFA36-205, B
Boiler and Pressure Vessel Steel Plate Steel-exporter()zzjygt.com Skype: jy-steel-plate 1. Steel Standards: GB/T713, ASTM, GB713, JISG3103, JISG3115, JISG3118, JISG3119, JISG3124, GB6645, GB3531, DIN17155, ASME, EN10028-2, EN10028-2, NFA36-205, B
New Equipment | Assembly Services
14 PINS BUTTERFLY GLASS PACKAGE Low temperature glass feed-through package is suitable for Butterfly Type Module, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc. glass-to-metal sealed package 14 PINS BUTTERFLY CERAMIC PAC
949-07-15240 INVERTER SET B836E0163-2-2 GPD402 .75H/230 B836E0163-3-1 GPD402 .75H/230 B836E0165 JUSPEED-F BOARD CA133-3 F/V CONVERTER CA141-1 DUAL POWER SUPPLY CA224 ISOLATION BOARD CACR-15-YU1 SERVO PACK CACR-1R44SFB PCB CACR-IR151515EB SER
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