Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Universal Board Support System for all Printers and Chipshooter, Dispensers and Placement and AOI machines. The new Red-E-Set substrate support system is designed for screen printers of single- and double-sided printed circuit boards. The patented R
New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision and Optics System The simultaneous up/down Optical Structure l
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
The K3-II is designed to meet the printing demands of extra large board sizes with maximum board size supported 610mm x 610mm. Vision and Optics System The simultaneous up/down Optical Structure large resolution (1.3 megapixel) digital camera enhan
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
High Quality and low cost stencil wipes for SMT screen printing applications. Increase throughput and lower costs. Selectronics covers both Dek and MPM for all sizes.
