General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
Layout methodology, Layout specs, Digital/Analogue, High voltage/ high current, High frequency High Speed/Transitions, Differential, Reflection, X-talk, Video/graphics, Impedance / Capacitance / Induction / Resistivity, Earth loop, EMI, etc.
BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
Theory of adhesion, polymer families, physical and chemical properties of epoxies, urethane, silicones, conformal coatings, specifications, applications, properties, performance, curing mechanisms, thermal and UV curing, polymeric inspection, etc.
KEPOCH stencils are all laser cut to meet the demands for accuracy and repeatability. Exceptional gasketing and paste release.
KEPOCH stencils are all laser cut to meet the demands for accuracy and repeatability. Exceptional gasketing and material release. Easy cleaning
KEPOCH inspection templates are made from an user friendly SD material that when applied to the PCB is transparent for easy component location. A inexpensive in-line QC tool for component checking.
Through hole/SMT PCB assembly equipments
Stencil printers/Reflow oven/Glue dispensers
Free Internet service, free mail picture Java applet script and also Market news rate and quate and more
