New Equipment | Surface Finish
The Oracle is the smallest and most flexible full production cluster system on the market. The system consists of a central vacuum transport (CVT), vacuum cassette elevators and up to four process reactors. These process reactors are docked to the ce
New Equipment | Test Equipment - Bond Testers
The TR8100H SII is the latest ICT with High Throughput and High Accuracy for large and complex PCBAs. The TR8100H SII is the top-of-the-line board test system targeting the low-voltage testing market. TR8100H SII's vacuum fixture system ensures full
New Equipment | Industrial Automation
General Electric GIVEN YOUR BEST ! PLEASES mailto:unity@mvme.cn Contact: Sandy Lin mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 General Electric Company is an Americanmu
New Equipment | Rework & Repair Equipment
Condition: New Machine Type: Machine for soldering&removing a chip Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, Personal repair shop, Repair shop, University Laboratory After Warranty Service: Video technical support
New Equipment | Rework & Repair Equipment
Name: BGA Soldering desoldering Machine for motherboards repairing Condition: New Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, mobile phone assembly, Computer production and services, Repair shop, Electronic repair j
New Equipment | Rework & Repair Services
Condition: New Machine Type: BGA rework station Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail After Warranty Service: Video technical support, Online support, Spare parts Video outgoing-inspection: Provided Machinery
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Designed for paste inspection to increase high throughput productivity in SMT production line. Our latest innovation in Advanced 3D Solder Paste Inspection (SPI) is designed to specially cater to different sizes of PCB assembly to be examined at mic
Designed for various sizes of PCB assemblies to increase production efficiency and cost savings for electronic manufacturing services, communication industry, etc. Our latest innovation in Advanced 3D Optical Inspection (AOI) is designed to speciall
Designed for various sizes of PCB assemblies to increase production efficiency and cost savings for electronic manufacturing services, communication industry, etc. Our latest innovation in Advanced 3D Optical Inspection (AOI) is designed to speciall
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Designed for paste inspection to increase high throughput productivity in SMT production line. Our latest innovation in Advanced 3D Solder Paste Inspection (SPI) is designed to specially cater to different sizes of PCB assembly to be examined at a m
