1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
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Flex part 2Layer PCB Polymid PCB thickness: 0.15mm Yellow coverlayer White Silkscreen Surface treatment: ENIG Min Line/space: 6/6mil Min hole: 4mil Rigid part 6Layer PCB PCB thickness: 0.8mm Green solder mask White Silkscreen Surface treatment: ENIG
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
4Layer PCB TG≥135 degree PCB thickness: 1.6mm Copper thickness:4OZ Green solder mask White silkscreen Surface treatment: ENIG Min Line/space: 20/20mil Min hole: 28mil Brand Name:SYSPCB
Layer: Single-Sided Price：USD275.50 Quantity :3Panel Min Holes：2.00mm surface Treatment:ENIG solder mask:White silk screen : Black Board Thickness: 1.6mm Cu Thickness: 35um Aluminium Model: 5052 Thermal Conductivity: 150W/m. K Breakdown Voltage:
1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ---------- SOLDER MASK (TOP)
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
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