SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Next Scheduled Public Courses: May 6, 2008 ~ Dallas, TX May 7, 2008 ~ Singapore May 8, 2008 ~ Penang, Malaysia May 14, 2008 ~ Las Vegas May 14, 2008 ~ Boston, MA June 11, 2008 ~ Hsin-Chu, Taiwain July 18, 2008 ~ San Francisco, CA August 8, 2008 ~ S
1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ---------- SOLDER MASK (TOP)
The SUSS MicroTec MA100RR Reel-to-Reel Proximity Mask Aligner is specifically designed for volume production of tape for tape carrier packages (TCP) and flex based chip scale packages (CSPs), like the �BGA. The tool can also be used for products requ
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