New SMT Equipment: maximum (Page 1 of 71)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

DH-800 Robot Automatic Dispenser

New Equipment | Soldering Robots

Model: DH-800 Robot Automatic Dispenser product model: DH-800D Dispensing range: 300/300/90 maximum load Y/Z:  10KG/6KG Speed X& Y/Z(mm/sec)   500/500/300 external dimensions : 465*495*697mm Body weight(KG): 42 capacity of decomposition :0.01m

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

ML-HMH-830  PCBA coating machine PCBA coating system

ML-HMH-830 PCBA coating machine PCBA coating system

New Equipment | Coating Equipment

R (R--->L)  PCB width range  50-450mm Adjustment method  Intelligent automatic adjustment  X.Y axis maximum running speed 800mm/s  Y axis positioning accuracy 士0.02mm Z axis maximum running spe

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

JUKI RS-1XL Pick and Place Machine

JUKI RS-1XL Pick and Place Machine

New Equipment | Pick & Place

JUKI RS-1XL Pick and Place Machine Speed:42000CPHPCB Size : 650×560㎜Feeder input:112pcsWeight: 1850KGProduct description: JUKI RS-1XL Pick and Place Machine, Speed:42000CPH, PCB Size : 650×560㎜, Feeder input:112pcs, Weight: 1850KG   JUKI RS-1XL P

Qersa Technology Co.,ltd

ERSA POWERFLOW Wave Soldeing Machine

ERSA POWERFLOW Wave Soldeing Machine

New Equipment | Soldering Robots

ERSA POWERFLOW Wave Soldeing Machine Solder volume: 820 kg working width: 508 mm Weight: 2,200 bis 3,000 kg Dimension: 4,200 to 4,950x1,510x1,565 mm ERSA POWERFLOW Wave Soldeing Machine ERSA POWERFLOW Wave Soldeing Machine ERSA POWERFLOW Wa

Qersa Technology Co.,ltd

Hanwha HM520 MF Pick and Place Machine

Hanwha HM520 MF Pick and Place Machine

New Equipment | Pick & Place

Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma

Qersa Technology Co.,ltd

ASM DEK TQ SMT Stencil Printer

ASM DEK TQ SMT Stencil Printer

New Equipment | Pick & Place

2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time:5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm   ASM DEK TQ SMT Stencil Prin

Qersa Technology Co.,ltd

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