New SMT Equipment: maximum allowable warpage (Page 1 of 20)

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

DEK E SMT Stencil Printer

DEK E SMT Stencil Printer

New Equipment | Pick & Place

2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm   DEK E SMT Stencil Printer DEK E SMT Stenc

Qersa Technology Co.,ltd

DV-7000 Heli-Flow Pump

DV-7000 Heli-Flow Pump

New Equipment | Dispensing

The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,

ASYMTEK Products | Nordson Electronics Solutions

JUKI JM-20 Hybrid Placement Machine

JUKI JM-20 Hybrid Placement Machine

New Equipment | Pick & Place

JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603~50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603~50mm, Place Speed:15,500 CPH  

Qersa Technology Co.,ltd

KOH YOUNG ZENITH 2 3D AOI

KOH YOUNG ZENITH 2 3D AOI

New Equipment | Test Equipment

KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R

Qersa Technology Co.,ltd

PTI-500 First Article Inspection Tester

PTI-500 First Article Inspection Tester

New Equipment | Inspection

PTI-500 First Article Inspection Tester 版本号:PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be

Qinyi Electronics Co.,Ltd

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

mySelective 6746 Selective Soldering System

mySelective 6746 Selective Soldering System

New Equipment | Selective Soldering

The Vitronics Soltec mySelective 6746 is a selective soldering automation workcell that has been optimized for maximum throughput and flexibility while minimizing its footprint in the factory. Inline processes and intuitive programming features enhan

Vitronics Soltec

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