The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
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PTI-500 First Article Inspection Tester 版本号：PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be
New Equipment | Board Handling - Conveyors
Inverts (flips) Printed Circuit Assemblies upside down for bottom side processing. SMEMA Compatible, touchscreen control, 450mm maximum conveyor width. Two models to choose from. The Anda PCB Inverter / Flipper is a compact inverting module for use
Packed with innovative placement and vision technologies, Assembleon provides optimum flexibility for any medium/high-volume production environment. When speed is not the main priority... But feeder positions and component range are Opal-XII is the
The high-end system in the series is the INSIGNUM 4000 Laser which exhibits the highest precision at an impressive cycle time of less than 4.8 seconds. The ASYS inline Laser marking system, INSIGNUM 4000 Laser, is used for direct laser marking of so
Since 1977, Barry Industries has manufactured the highest quality chip attenuators available. All chip attenuators are designed and manufactured in our 40,000 square foot facility in Attleboro, Massachusetts USA. Vertical Integration is our key to en
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Simultaneous Pickup Solution with One Feeder, Highest Speed LED Production System in the World The world's first SLM100 Series LED mounter capable of realizing simultaneous pickup with one feeder. It provides an optimum LED production system. Sim
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