New SMT Equipment: maximum flip (Page 6 of 8)

Mega SA® Solvent Cleaner

Mega SA® Solvent Cleaner

New Equipment | Cleaning Equipment

Austin American Technology’s Mega SA® cleaning system is designed for primary defluxing and final cleaning prior to sealing. It uses semi-aqueous chemistries requiring a water rinse. The Mega SA® is compatible with Terpenes, and petroleum-based solve

Austin American Technology

SLM100 Series - High-Speed, SMART LED Mounter

SLM100 Series - High-Speed, SMART LED Mounter

New Equipment | Pick & Place

Simultaneous Pickup Solution with One Feeder, Highest Speed LED Production System in the World The world's first SLM100 Series LED mounter capable of realizing simultaneous pickup with one feeder. It provides an optimum LED production system. Sim

Hanwha Techwin CO., LTD.

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

Genesis SMT Pick and Place Series

Genesis SMT Pick and Place Series

New Equipment | Pick & Place

The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime

Universal Instruments Corporation

Mega™ ION Batch PCB Cleaners

Mega™ ION Batch PCB Cleaners

New Equipment | Cleaning Equipment

World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz

Austin American Technology

PCB Invertor SMI-1A050

PCB Invertor SMI-1A050

New Equipment | Pick & Place

contact: jacky.li@samtronik.com Categories PCB Loader & Un-Loader Album View larger image Brand SAMTRONIK Model SMI-1A050 Interface SMEMA Transmission height 910mm±

Samtronik International Limited

AT-GDP Series - BGA / QFN / SMT Placement & Rework Stations

AT-GDP Series - BGA / QFN / SMT Placement & Rework Stations

New Equipment | Rework & Repair Equipment

The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework

Advanced Techniques US Inc. (ATCO)

Fuzion SMT Pick and Place Series

Fuzion SMT Pick and Place Series

New Equipment | Pick & Place

Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi

Universal Instruments Corporation

Mydata MY100e Series Pick-and-Place Machines

Mydata MY100e Series Pick-and-Place Machines

New Equipment | Pick & Place

Where High Mix Meets High Speed. With the MY100e series pick-and-place machines, there’s no need to make the usual trade-offs between speed and flexibility. With the fastest changeovers in the industry and workcell solutions reaching speeds of up t

Mycronic Technologies AB

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech


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