New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
New Equipment | Industrial Automation
YOKOGAWA 103131LSNL PANEL METER YOKOGAWA 103211A WATTMETER YOKOGAWA 103211ABUW1AED WATTMETER YOKOGAWA 103221ARHC7DAC AB40 WATTMETER YOKOGAWA 235300 DIGITAL METER YOKOGAWA 235905-4004-55 AC WATTMETER YOKOGAWA 2404 MEGGER YOKOGAWA 2404-14 MEGGER
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
Partlow Partlow Partlow Partlow 1160200 4000 PEN DR BD 4110-000-002 CHART RECORDER 4603502 S.IV PEN DR BD 413100000021009 CHART RECORDER 04603502F CHART REC BOARD 413100000615004 CHART RECORDER 04603502J CHART REC BOARD 5-1000 TEMP CONTROLLER 04
Create Comprehensive PCB Documentation to Drive PCB Fabrication, Assembly and Inspection BluePrint-PCB is the premier PCB document authoring solution to create the manufacturing specifications for an electronic product. Comprehensive documentation r
Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
New Equipment | Rework & Repair Equipment
BEST has been designing and fabricating circuit frames for sale and for inhouse use for several years. We have both epoxy and dry film circuit frames- you have the choice! In the dry film adhesive system- damaged pads and traces can be replaced witho
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
