Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Streamtek Electronics provide HiRel SMD Packages. Standard products include SMD-2, SMD-1, SMD-0.5, SMD-0.2, TO263 package, SMD-FP Package and customized packages with similar configuration. These packages are complied with MIL-PRF-19500, MIL-STD-750,
Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
Specifications: Features: As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and ty
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
| 1 |
.gif)
winsouce.jpg)