The MVP approach to 3D AOI utilizes the combination of both 2D and 3D AOI technologies bringing the advantages of high speed and superior defect coverage for complex defects. MVP’s advanced software tools are the key to taking advantage of each of th
Otek AOI is an Automatic Optic Inspection Equipment developed and manufactured by the GFirst OEIC Co., Ltd., in Xiamen, China. Given the level of operators and the practical manufacturing environment they work in, the design tenet of Otek AOI is its
Reliable optical inspection of wave, reflow, pre-reflow and selective soldering. More than an entry into AOI Optimal, ergonomic loading through large opening angle Superior resolution, reliable 01005 and fine-pitch inspection Scalable camera t
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
The world's first and only combo system with simultaneous 3D AOI and 3D AXI. It’s a unique solution for maximum efficiency and flexibility in PCB inspection, combining extreme reliability and effective process control. Optical and simultaneous 2-D,
In-line X-ray and optical inspection for high-end electronics production. TRAILBLAZING X-RAY TECHNOLOGY AND ULTRA-MODERN XM CAMERA TECHNOLOGY IN ONE SYSTEM. The in-line X-ray system X7056-II is primarily distinguished by high throughput and first-c
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
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