New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
Double-sided Aluminium PCB Layer count: 2 Material: Bergquist HT-04503 Aluminum Board thickness: 1.6mm Copper thickness: 1oz Thermal conductivity: 2.2W/m-K Breakdown voltage: 6.0KV Application: LED light
New Equipment | Test Equipment
Metal dome (also named snap dome, tacticle domes) is the most improtant part of the switches. The metal domes are mainly use in the membrane switches, printed circuit boards, flexible circuit boards. The raw material is the thickness from 0.05mm to 0
Specification: Backing: Kraft paper Adhesive: rubber Length: 200/500mm Thickness: 0.11mm Adhesion: 4N/in Tensile strength: 130N/in Features: Low initial tack Self-sticky can get good adhesion Made of crepe and Kraft paper of good masking e
1. Bergquist metal backed 2. 1.6mm thick, single sided, 1oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: LED prodcuts, High power supply, Computers etc
1. Thermagon metal backed 2. 1.6mm thick, single sided, 1 oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: High power supply, Computers, Industrial power equipment, LED
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
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