High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Soldering Robots
Model: DH-800 Robot Automatic Dispenser product model： DH-800D Dispensing range： 300/300/90 maximum load Y/Z: 10KG/6KG Speed X& Y/Z(mm/sec) 500/500/300 external dimensions ： 465*495*697mm Body weight（KG): 42 capacity of decomposition ：0.01m
KSUN R05 JUKI Feeder Calibration It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of device pos
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Effective Solutions for any Odd-Form Application on any OEM Platform. Count On Tools has the experience and manufacturing flexibility to be able to develop custom engineered solutions to satisfy your individual Process Requirements. With over 20 y
pcb mold punching machine ,PCB punching for FPCB board CWPLCWPM Size(mm) 930 X 880X1230 Size 800x730x1230 Contribute(ton) 8 Contribute(ton) 8 Weight 680kg Weight 580kg FPC /PCB punching
Features for pcb punch machine : This machine depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual . Cast iron framework for rigidity . The Models are changeable and easy set up . Moveable lower die for easy loading
Model CWDJ-300 CWDJ-400 CWDJ-500 Working Area/mm 300(X)*300(Y)*100(Z) 400(X)*400(Y)*100(Z) 500(X)*500(Y)*100(Z) Size/mm 490(L)*528(W)*679(H
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