New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS+ 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 25mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
New Equipment | Rework & Repair Equipment
The need to reduce PV manufacturing costs combined with the present shortage of polysilicon feedstock are driving a steady reduction in wafer and cell thicknesses. The PS-900-Solar Soldering System is the perfect solution Soldering of wires (tabs and
Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter
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