The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
With 8/10/12 controlled upper and lower Microjet heating zones,the Microjet-N8/N10/N12 Series SMT reflow ovens, with thermal accuracy of ±1˚C, Patent design with micro nozzles spray hot air and with holes around nozzle to take hot air back, so to mak
The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website
New Equipment | Cleaning Equipment
Aqueous and Semi-Aqueous PCB Cleaning Systems The MicroJet™ Inline cleaning System with Progressive Energy Dynamics™ provides the highest level of SMT cleaning available on the market today. Progressive Energy Dynamics (PED™) is a proprietary spray
New Equipment | Cleaning Equipment
Durable Construction The MicroJet in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding, rigid metal chassis, unibody construction, a detachable load section, and hinge
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