High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
We manufacture and export Swaged Earth Rods (250 Microns) available with driving head and coupling, made from High Grade Brass, CDA 360 Brass, Free Cutting Brass or any special Brass Composition as per customer specification. It is mainly used in swi
We work as an integrated extension of your manufacturing department in assembling surface mount and thru hole assemblies. On consignment basis or turn key, we will do our best to meet our manufacturing deadlines and ship JIT (Just In Time). When Qu
The RTI-7500, high-speed PCB inspection system, featuring high precision (1-micron accuracy), and color inspection option.
Micron, Motorola, NEC, Ohmron, Onsemi, Phillips, Texas Instruments and more.....
New Equipment | Solder Paste Stencils
MLT stainless steel and non-metal stencils (i.e. Kapton) are laser fabricated for applying solder paste, flux, solderballs, to circuit boards, wafers, and components for prototypes, volume production, and PCB rework.
New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
New Equipment | Fabrication Services
PFC designs, manufactures and assembles fine line flex circuits. 50 micon line and space is done in production on a daily basis. 37.5 microns done for prototoypes.
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
New Equipment | Rework & Repair Equipment
MLT provides laser services for selective solder mask removal as a precise and controlled rework option. No more scrapping or tedius hours to rework selective areas to recover simply unwanted solder mask. This same process works from many other mat
