New SMT Equipment: mid-chip solder balling (Page 2 of 8)

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

ChipFlo

New Equipment |  

Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly

Research International

SMT Solutions

New Equipment |  

We are a Re-balling company based in Chihuahua, Chihuahua.Our core business is the Salvage and Recovery of Electronic Components.Also we offer technical consulting and training in SMT and Wave Soldering.

SMT Solutions

BGA Reballing

BGA Reballing

New Equipment |  

Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package

Artek Manufacturing Inc

Solder Spheres

Solder Spheres

New Equipment | Solder Materials

Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and indu

EasySpheres LLC

BGA Optical and X-Ray Inspection Posters

BGA Optical and X-Ray Inspection Posters

New Equipment | Inspection

Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3

ASKbobwillis.com

SOLDER MEISTER UNIX-700FV Vertical Inline Soldering Robot

SOLDER MEISTER UNIX-700FV Vertical Inline Soldering Robot

New Equipment | Soldering Robots

Highly Flexible In Insertion Angles. Vertical inline soldering robot, UNIX-700FV is an ideal for irregularly shaped works into which is hard to insert the tip. The vertical multi-joint is utilized to freely change the head angle and quick operation.

Japan Unix Co., Ltd.

BGA Socketing Systems

New Equipment |  

Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he

Advanced Interconnections Corporation

Advanced Image Processor (AIP)

New Equipment |  

The AIP is a new Windows NT based Image Processor that surpasses all current industry standards. New functionality includes: * Automatically detects solder balls and voids. * Automatically corrects xray image distortion using dual calibration met

Nicolet Imaging Systems

SOLDER MEISTER UNIX-410S High Performance Soldering Robots

SOLDER MEISTER UNIX-410S High Performance Soldering Robots

New Equipment | Soldering Robots

The premium model that achieves fast, precise, and high-quality soldering operation. Offering two slim types of high performance soldering robots that letting our customers choose the best one to fit their objectives. Both come with a clean cut feed

Japan Unix Co., Ltd.


mid-chip solder balling searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

World's Best Reflow Oven Customizable for Unique Applications
High Throughput Reflow Oven

High Precision Fluid Dispensers
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

Software for SMT placement & AOI - Free Download.