The Z8 MUZE OTP microcontrollers feature Maximum Memory with a UART and ZiLOG's Expandable EPROM. The MUZE family parts offer 4 KB to 64 KB of on-chip OTP memory that can be programmed in-circuit. All of the parts in the family include a UART and sup
This specially designed cleaning card cleans thermal print heads that are not easily accessible. The patented presaturated thermal printer cleaning card is saturated with 99.9% isopropyl alcohol. The safe, effective, spun-bonded card allows for the t
Trust our Test Engineering Department-with nearly 50 years of test programming experience-to provide a turnkey solution for your GenRad Testers. We can provide the test program, test fixture and installation in one seamless operation. Test generatio
I. NPI (New Product Introduction) Promex is capable of starting with your schematic and shipping you an electrically tested electronic assembly for your final approval to your specifications. Specific services Promex performs for NPI are: Select par
The ENH908-NWY device is a powerful, high-performance Fast Ethernet switch, with all 8 ports capable of 10 or 100Mbps auto-negotiation operation (NWay), meaning that the switch could automatically negotiate with the connected partners on the network
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
New Equipment | Rework & Repair Equipment
Mobile Device Rework System Revolutionary new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, the Micra addresses the challenges of reworking technologies such as PoP, QFN
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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