New Equipment | Rework & Repair Equipment
These Made in America, Beau Tech RocHard MilProbes are the only complete line of probes available to meet the full spectrum of circuit repair, rework, and assembly needs from Through Hole to 2 mil pitch Surface Mount.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
CGS special polyimide film offers thermal conductivity, corona resistance, obe side insulation and one side conduction, anti-static and block light properties to meet these special applications. CGSTAPE-7458 (1mil) - 1 mil MT polyimide film CGS
CGS HN polyimide film has been used successfully in applications at high temperature. It can be laminated, metallized, punched, formed or adhesive coated. CGS has 1mil, 2mil, 3mil, 5mil and 10 mil HN polyimide films. CGSTAPE-7258 (1mil) - 1 mil
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
Bicheng provides R&D, high-tech, IT research companies and organizations large or small with high frequency RF/microwave PCB's. Technical parameters: *NPTH and PTH( 20 um) *Thermal stress: 288C/10sec *Permitivity: ER2.1-1
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD
Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.
