New Equipment | Assembly Services
Lead Time For Production Orders: Sample Lead time(days) Mass production lead time(days) Single sided PCB 1~3 4~7 Double si
108 and 1011 -40°to 325°C (-40°to 617°F) XF-782* Polyimide 2 mil > 108 and 1011
Mfg. Hardened and Standard UPS' to Mil-Spec and Hospital Grade (UL-2601, Mil Spec 1399, 701, etc.) Our UPS' and custom transformers are used world wide by the US Navy and Hospitals. Visit our web site and choose from existing offerings or let us hel
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
4Layer PCB TG≥135 degree PCB thickness: 1.6mm Copper thickness:4OZ Green solder mask White silkscreen Surface treatment: ENIG Min Line/space: 20/20mil Min hole: 28mil Brand Name:SYSPCB
New Equipment | Fabrication Services
PCB Manufacturing Capabilities Layer: 1-32 Finished Copper: 0.5-6oz Min. Line/Track Width: 4mil. Min. Line/Track Space: 4mil. Finished Board Thickness: 0.2-5.0mm. Min. Finished Diameter of PTH Hole: 0.2mm. No set-up cost for repeated order
In-house photoplotting, micro-modification, and CAD file generation or conversion for stencils, screens, and 1/4 mil resolution photoplots.
IPC-CC-830 / MIL-I-46058C Acrylics, Urethanes, Silicones and Epoxies
MIL-P-55110 approved for PTFE materials. Capabilities include PTFE, Thermoset materials, PTFE/FR4 hybrids, edge plating, wrap-around fingers and copper sealed vias.
Complete Fuji Line capable of placing 0402's-QFP's, BGA's. Capable of 15 mil pitch.
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