New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
CGS special polyimide film offers thermal conductivity, corona resistance, obe side insulation and one side conduction, anti-static and block light properties to meet these special applications. CGSTAPE-7458 (1mil) - 1 mil MT polyimide film CGS
CGS HN polyimide film has been used successfully in applications at high temperature. It can be laminated, metallized, punched, formed or adhesive coated. CGS has 1mil, 2mil, 3mil, 5mil and 10 mil HN polyimide films. CGSTAPE-7258 (1mil) - 1 mil
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
Bicheng provides R&D, high-tech, IT research companies and organizations large or small with high frequency RF/microwave PCB's. Technical parameters: *NPTH and PTH( 20 um) *Thermal stress: 288C/10sec *Permitivity: ER2.1-1
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD
Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
New Equipment | Solder Paste Stencils
Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma
