Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.
Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
New Equipment | Fabrication Services
Minimum line width/space: 5mils Surface finish: OSP Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
New Equipment | Assembly Services
Rigid PCB SERIAL ITEM TECHNICAL DATA 1 Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board
Flexibility and conformability are the key features of this product group. High heat resistance and tensile strength of the glass cloth satisfy many electrical insulation application requirement. CGS have glass cloth tapw coated with different adh
Quick Details: Heavy Copper 3OZ, Coil Design, 8mil / 8mil Base Material Fr4 TG140 Layer Counts 2L Board Thickness 1.60 mm
New Equipment | Fabrication Services
Cheap PCB Manufacturing Fr4/CEM3 PCB The most common PCBs, for every PCB supplier, most cost-effective. High Tg PCB More heat resistant, better dimensional stability, PS is a PCB supplier of Tg130-190 boards (FR4).
The Fire Problem The Flame ProblemThe ever-increasing and widespread use of electronic devices, such as laptops, tablets, personal digital assistants (PDA’s) and smart phones is requiring longer and longer battery life. The batteries become increas
Polyimide tape can either be amber or clear in color, and the film thickness ranges 1 and 3 mils while the adhesive may range from 1 to 2 mils thick. It may be double sided, and the adhesive may be silicone or acrylic based. Anti-static Polyimide t
8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 2
