Mfg. Hardened and Standard UPS' to Mil-Spec and Hospital Grade (UL-2601, Mil Spec 1399, 701, etc.) Our UPS' and custom transformers are used world wide by the US Navy and Hospitals. Visit our web site and choose from existing offerings or let us hel
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
In-house photoplotting, micro-modification, and CAD file generation or conversion for stencils, screens, and 1/4 mil resolution photoplots.
IPC-CC-830 / MIL-I-46058C Acrylics, Urethanes, Silicones and Epoxies
MIL-P-55110 approved for PTFE materials. Capabilities include PTFE, Thermoset materials, PTFE/FR4 hybrids, edge plating, wrap-around fingers and copper sealed vias.
Complete Fuji Line capable of placing 0402's-QFP's, BGA's. Capable of 15 mil pitch.
Materials: Rogers 4003C Layer count: 2 layers;60 mil thick Application: Microwave communications Finishing: Leadfree HASL
Streamtek Electronics provide HiRel SMD Packages. Standard products include SMD-2, SMD-1, SMD-0.5, SMD-0.2, TO263 package, SMD-FP Package and customized packages with similar configuration. These packages are complied with MIL-PRF-19500, MIL-STD-750,
min trace width/space 3 mils, min hole diameter 0.15mm
New Equipment | Solder Paste Stencils
Solder Paste Printing Stencils The industry standard to manufacture solder paste stencils is to use Yag lasers with the capability to cut to a tolerance of +/- .0002". Stentech, with 12 Yag lasers across North America, can provide you the quality an
