New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I
sales5_etlimited_cn Aluminium PCB,single sided PCB,China PCB&PCBA manufacturer key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc. Board th
sales+etlimited+cn china pcba supplier,china card read pcba supplier,china 8 layers pcba(pcb assembly) supplier key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1,
Layers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/space: 8/5.9 miles, Thickness: Rigid board: 2.00mm, Flex board: 0.24mm Size: 397.89 x 555mm
Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB Quik Details: Product Name: Solar Panel Rigid PCB Base Material: FR4 Epoxy Resin Bare Board Size: 120mm x155mm Surface Finishing: Leaded HASL PCB Material Flamming rate: 94
New Equipment | Assembly Services
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: FPC RoHS Compliant • Number of Layers: Single-sided, Double-sided, Multi-layers and Flex-Rigid PCB • Base Material: Polyimide(Kapton), Polyester(PET), FR4 • Copp
At Barry: custom requests are common and welcome. We enjoy the challange. Extensive capabilities, wide material selection and state-of-the-art equiptment (including in-house plating and machining) ensure we can deliver a component fitting your exact
√ Technological Capabilities No. Items technological Capability 1 Layer 1-2
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
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