New SMT Equipment: misaligned (Page 1 of 2)

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

LineMaster DM

New Equipment | Inspection

The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance.  The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing.   Combining both inspection cap

Solder Paste Inspection, Inc.

LineMaster DM

LineMaster DM

New Equipment | Inspection

The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance.  The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing.   Combining both inspection cap

Solder Paste Inspection, Inc.

Fuji and Panasonic Machine Rebuild Services

Fuji and Panasonic Machine Rebuild Services

New Equipment | Pick & Place

Service is available for all CP, IP, and QP series machines. This is a complete inspection and rebuild of the machine. The machine is inspected for worn, misaligned, or broken parts. These parts are then rebuilt, repaired, or replaced as necessary.

SMT Research Inc.

Mini-Wave Selective solder optimizer

Mini-Wave Selective solder optimizer

New Equipment | Selective Soldering

The SolderStar WaveShuttle Selective has been specifically designed for daily testing and optimization of Mini-Wave Selective soldering machines. A specially configured array of titanium wave contact sensors are arranged on the underside of this meas

Solderstar

DRM-SMT-F Surface Mount Solder Joint Evaluation Training & Reference Guide

DRM-SMT-F Surface Mount Solder Joint Evaluation Training & Reference Guide

New Equipment | Education/Training

Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. With 44 pages and a compact 5.5 x 8.5 inch (14 x

soldertools.net

S3088 SPI – 100 % 3-D Solder Paste Inspection

S3088 SPI – 100 % 3-D Solder Paste Inspection

New Equipment | Inspection

High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3

Viscom AG

LPKF Flex Cutting and Depaneling Systems

LPKF Flex Cutting and Depaneling Systems

New Equipment | Depaneling

When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time

LPKF Laser & Electronics

JUKI RX-6 High Speed Compact Modular Mounter

JUKI RX-6 High Speed Compact Modular Mounter

New Equipment | Pick & Place

Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production

Juki Automation Systems

ScanFAB PCB Reverse Engineering Software

ScanFAB PCB Reverse Engineering Software

New Equipment | Software

Linking Existing Design to CAD & Production. ScanFAB is a flatbed scanner-based re-engineering system that has the capability of scanning PCB's, film, stencils, drawings, etc., to produce all the necessary data to re-manufacture a multi-layer PCB b

ScanCAD International, Inc.

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