Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
The Thermal Ceramics business of Morgan Advanced Materials has developed a versatile fiber, Superwool® Sealcoat™ HT, which is suitable for use in nearly a dozen furnace lining applications. From primary liner to emergency repairs, and backup insulati
| 1 |
