2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
Technical specification: I. Hardware System models / types Windows XP Professional Overall FootPrint (LxWxH) 800mm*850mm*1700mm Weight (Approximate) 150KG Adjustable machine
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Hanwha Pick and place machine Speed : 30,000CPH (Optimum) PCB : Max. 460(L) x400(W) Structure : 1 Gantry x 6 Spindles/Head Component range: 0402 ~ 55mm(H 15mm) Product description: Hanwha SM482 Plus Pick and Place Machine, Speed : 30,000CPH (Optimum
Four Depaneling Speeds PCB Separator Machine With Circular And Linear Blades Why us 1. Engineers available to service machinery oversea. Engineers are available to be sent to freign countries to do machinery training and offer technical supp
Why us 1. Engineers available to service machinery oversea. Engineers are available to be sent to freign countries to do machinery training and offer technical support 2. Mature technique & forerunner to pro
PCB Separator machine advantages : 1. Easy maintanance and operation 2. Low bending stress,no vibration 3. specially for resin substrate PCB with pre-scored V groove 4. safety use PCB Separators Specifications : Model CWV-1A
Feature A powerful and optimum sized benchtop robot with a working area of 19.68"x19.68" (500x500mm) and extra Z reach of 5.90" (150mm). Ideal for large non contiguous structures and for larger dispensing equipment or apparatus. The CWDM-2 is suit
Model CWDJ-300 CWDJ-400 CWDJ-500 Working Area/mm 300(X)*300(Y)*100(Z) 400(X)*400(Y)*100(Z) 500(X)*500(Y)*100(Z) Size/mm 490(L)*528(W)*679(H
Dispensing Robot for SMT Industry Applications: Dispensing Robot 1 , LED package 2 , Mobile phone plate coating or dispensing button 3 , Speaker Dispensing 4 , Dispensing sealing the battery case 5 , The semiconductor package 6 , Power component pa
