New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
New Equipment | Board Handling - Storage
The Dr.Storage T40W are plug and play, fully auto dry cabinets which can bake at a stable 40℃ and maintain a consistent The T40W Baking Cabinets Series has a double wall design to ensure it maintains a stable According to J-STD-033B, using a T40W
Manufacturer Part#: MP2060-10.0-1% Product Category: Through Hole Resistors Manufacturer: Caddock Electronics Inc. Description: RES 10 OHM 60W 1% TO220 MP2060-10.0-1% Datasheet Pack
New Equipment | Tape and Reel Services
Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani
New Equipment | Board Handling - Storage
SmartDRY™ desiccant dry cabinet for SMT components storage, intelligently controls MSL to the J-STD-033 specification while mitigating ESD at low relative humidity levels. Discover True Dry Storage Performance: • J-STD-033 Specification • Less than
PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
MODEL 80 - For medium to large boards Overall Dimensions: L: 476 W: 508 D: 457 mm Board Capacity: W: 457 D: 457 mm - Standard card guides are 317,5 mm deep, optional 457 mm guides for very large boards. - 75 numbered slots measure 2,8 x 3,9 mm on a 5
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