New Equipment | Test Equipment
The N4861B MIPI D-PHY stimulus probe enable users to perform real-time digital serial analysis and generate real-time digital serial stimulus of the MIPI D-PHY interface. The N4861B support the CSI-2 (Camera Serial interface) and DSI (Display Seria
New Equipment | Test Equipment
Description Please note: Since April 30 2005, the Agilent 8133A 3 GHz Pulse Generator, including all product options, is obsolete. Support will be provided until December 19th 2010. The recommended replacement products are the industry-leading Agi
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
dataCon has designed and manufactured many of the current backplane technologies such as VME 64X, PCI, and VXI. We can provide substrate procurement (from one of our partner companies or the customer's approved supply base), press fit and solder asse
3DCreate makes it possible for any user to quickly create 3D digital replicas of current and developmental production equipment from existing design engineering information. Web based animated or static 3D models that can be operated and viewed from
Dynamic Engineering designs, manufactures, assembles and tests mezzanine level boards. Submit your assembly requirements for quotation. Sales@dyneng.com
1.For controlling of small flow and low-middle viscosity materials 2.Syringes storing material, it can be used for precise dispensing 3.The question of fluid level affecting the dispensing volume has been solved fully. 4.The material of the part
New Equipment | Assembly Services
Multiiple assembly lines and highly trained staff support IPC level 1, 2, and 3 assembly of both surface mount and through-hole technology products. PCB assembly we offer: Surface mount, including BGAs and micro-BGAs Through-hole Mixed
1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
