New SMT Equipment: msl bake time thickness (Page 1 of 1)

Baking

Baking

New Equipment |  

The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref

OX3 Corporation

  1  

msl bake time thickness searches for Companies, Equipment, Machines, Suppliers & Information

Selective Soldering Nozzles

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.
SMT feeders

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
2024 Eptac IPC Certification Training Schedule

Software for SMT placement & AOI - Free Download.
design with ease with Win Source obselete parts and supplies

Thermal Transfer Materials.