New SMT Equipment: msl-2 (Page 1 of 1)

Baking

Baking

New Equipment |  

The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref

OX3 Corporation

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msl-2 searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Component Placement 101 Training Course
PCB Handling with CE

Stencil Printing 101 Training Course


Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
High Throughput Reflow Oven

High Throughput Reflow Oven
Assembly Automation Technology

"回流焊炉"