High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
� Two camera, automatic vision servo PCB correction � Right is Right, right side shuttle load position � Unsurpassed vibration squeegee printing technology � Bottom side ultrasonic stencil cleaner � Vibrating squeegee assembly The SemiTouch STAV prin
Model:FUJI IP – 3 5000 w/MTU-4R Date of manufacturing: June, 1995 Hours Run:: 30,884 Hours SPECIAL REMARKS:: With right side MTU installed, With Vision Monitor, Reject Part conveyor installed. Machine Software Version: V2.52 Machine Vision Sof
Affordable Quality in an easy-to-use, lightweight, Thermal Imaging System The new ToughCam P-series portable thermal imager offers outstanding image quality and radiometric temperature measurement performance in an affordable, rugged and easy to us
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
New Equipment | Test Equipment
The Pilot V8 represents the latest frontier in flying probe test technology, and is the complete solution for those who want maximum performance: the highest test speed, test coverage and flexibility, whether they are testing prototypes, manufacturin
Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio
A wide work scope range : able to handle large PCBs 50x50 mm 530x460mm. Variable component placement ability 0603mm (0201 inch)chips, QFP,BGA,CSP, odd-form parts Four high-speed precision head-based operation Can handle up to four - 18mm parts at
YSC Scope (Model YSC-70, YSC-130 and YSC-7014) with integrated LED lighting and camera are ideal for BGA, CSP and QFP inspection. Interchangeable 90 degree horizontal viewing prism tips from 0.5 mm to 2.0 mm size can be used for various stand off hei
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
