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Ultra 850XB BGA and Packaging AOI

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

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Component Placement 101 Training Course

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High Throughput Reflow Oven

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Low-cost, self-paced, online training on electronics manufacturing fundamentals