New SMT Equipment: mycronic certified solder paste (Page 1 of 2)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

ASM DEK TQ SMT Stencil Printer

ASM DEK TQ SMT Stencil Printer

New Equipment | Pick & Place

2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time:5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm   ASM DEK TQ SMT Stencil Prin

Qersa Technology Co.,ltd

QFN Rework Services

QFN Rework Services

New Equipment | Rework & Repair Services

BEST's QFN Rework Services Can Save Your Design and Save You Money BEST Inc. provides a variety of QFN rework services including the most popular QFN package styles. BEST has lots of experience in minimizing the voiding in QFN rework. BEST can mini

BEST Inc.

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

AIM SOLDER

New Equipment |  

AIM is a leading global manufacturer of solder assembly materials for the electronics industry. Our product line includes solder paste, liquid flux, bar, wire, preforms, adhesives, cleaners, chemicals, plating anodes and indium and gold alloys. We al

POWELL INDUSTRIES INC.

Mydata MY500 SMT Jet Printer

Mydata MY500 SMT Jet Printer

New Equipment | Printing

Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with

Mycronic AB

Mydata MY600 High-Speed SMT Jet Printer

Mydata MY600 High-Speed SMT Jet Printer

New Equipment | Printing

MY600 - Millions of dots ahead of its time. The next-generation MY600 Jet Printer now enables SMT producers to achieve optimal solder joints on complex boards at speeds of more than one million dots per hour, a 50% increase in throughput compared to

Mycronic AB

Contract PCB Assembly

Contract PCB Assembly

New Equipment | Assembly Services

STI is equipped with a state of the art 26,000 sq ft manufacturing area with the latest in high speed placement, inspection, and test equipment in addition to work cells to assemble complex box builds. Our personnel are uniquely qualified to assemble

STI Electronics

AMT Solder Powder

AMT Solder Powder

New Equipment | Solder Materials

Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low

AMTECH

Symbion P36 Plus - SPI  System

Symbion P36 Plus - SPI System

New Equipment | Inspection

Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D

Orpro Vision GmbH

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