Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head
New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
Mylar (plastic) Handy Stencil is used for manual printing.
New Equipment | Cable & Wire Harness Equipment
The Uni-M is the latest generation crimp applicators for use in both automatic and semi-automatic benchtop crimping machines. Banded terminals of open or closed barrel construction with either metal or plastic carriers can easily be processed. Eco
Advantage: suit to cut narrower or softer tape Specification: Tape width: 3mm ---- 22mm Tape length:13mm----59mm Core diameter: 25mm/32mm/75mm Power supply: AC 110v/60HZ, AC220V/50HZ VINYL TAPE, MASKING TAPE, CELLOPHANE YAPE, PAPER TAPE, POLYETHYLENE
Applicable Components： Small/Medium/Large Size Radial Components, Mylar, E-Cap, Matelized Capacitors, Inductors, LED's, Crystal Ocilators, Transistors, Lamps, and more... Features: Taping Pitch : 12.7~38.1 mm. Stepping Motor Driven, Stable & Acc
New Equipment | Cable & Wire Harness Equipment
An excellent solution for customers looking for a simple, low-cost crimping press. The UniCrimp 100 can deliver up to 2.2 tons (20 kN) of crimping force for applications up to 6 mm2 (10AWG). Simple design that is very easy to use. Extremely cost
Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
1661D89G01 Power Supply MMI P/S (old version) w/ AC/DC RT301-2 brick and 3MSC7 7380A31G01 card 115VAC 2 1661D89G02 Power Supply MMI P/S (old version) w/ AC/DC RT301-2 brick and 3MSC7 7380A31G01 card 230VAC 2 1661D89G03 Power Supply MMI P/S (old versi
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