Metal Covers are usually Kovar plated with Ni/Au. Covers are sealed to a ceramic or metal package, achieving a hermetic enclosure.
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
Minimum line width/distance: 4mil; Minimum aperture: 0.25mm; Technique: Immerged Ni/Au+Entek; Layers and thickness: 7/L, blind hole board
New Equipment | Assembly Services
14 PINS BUTTERFLY GLASS PACKAGE Low temperature glass feed-through package is suitable for Butterfly Type Module, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc. glass-to-metal sealed package 14 PINS BUTTERFLY CERAMIC PAC
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