New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
New Equipment | Rework & Repair Equipment
The BEST PCB circuit trace repair kit gives you the tools you need for fast modification and repair of PCB circuit traces. Our online PCB repair training videos, our master instructors along with these materials allows you to meet the original PCB qu
New Equipment | Rework & Repair Equipment
Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of
New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
New Equipment | Assembly Services
14 PINS BUTTERFLY GLASS PACKAGE Low temperature glass feed-through package is suitable for Butterfly Type Module, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc. glass-to-metal sealed package 14 PINS BUTTERFLY CERAMIC PAC
Pure tungsten sheet, plate, tungsten alloy sheet, plate. Alloy Sheet(thickness) W1 0.5-8.0 CW1 0.5-8.0 W2 0.5-8.0 WAl1 0.5-8.0 WAl2 0.5-8.0 WAl3 0.5-8.0 WCe15 0.5-8.0 WTh7 0.5-8.0 WTh10 0.5-8.0 WTh15 0.5-8.0 Wl10 0.5-8.0 W-Ni-Fe 0.5-8.0
Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are
New Equipment | Coating Materials
Our conductive non-woven fabric is plated Cu+Ni on non-woven fabric,it has good conductivity and shielding effectiveness,it is widely used in various electronic products.The thickness of our non-woven fabric is 0.035mm,0.045mm,0.04mm,0.08mm,0.10mm,0.
New Equipment | Solder Paste Stencils
NiEX™ electroformed stencils use the same proprietary process as our market leading AMTX™ stencils. The NiEX™ stencil has a higher Knoop Hardness (HK) than our standard AMTX product for those very thin less than .003 applications such as wafer bumpin
New Equipment | Test Equipment
The hand-held PHASCOPE® PMP10 is ideally suited for quality control in the electroplating and printed circuit board (PCB) industries. Because the instrument employs the phase-sensitive eddy current method (ISO 21 968), it allows the measurement of me
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