New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
At Barry: custom requests are common and welcome. We enjoy the challange. Extensive capabilities, wide material selection and state-of-the-art equiptment (including in-house plating and machining) ensure we can deliver a component fitting your exact
New Equipment | Test Equipment
The Energy Dispersive X-Ray Fluorescence Analysis (ED-XRFA) is a method for measuring the thickness of coatings and for analyzing materials. It can be used for the qualitative and quantitative determination of the elemental composition of a material
New Equipment | Fabrication Services
Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...
New Equipment | Test Equipment
Highly Accurate, Full Precious Metal Analysis The QSX-295T was developed with over twenty years of experience working with jewelers from New York City to Los Angeles. The analyzer offers a simple to operate solution for highly accurate identificati
Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa
Ridgid, bare board manufacturing of military, high reliability, quick-turn, prototype, single, double-sided, and multilayer boards, blind and buried vias, carbon ink, immersion silver, immersion tin, reflow, hasl, nickel and gold, all colors of legen
New Equipment | Assembly Services
• Material: neodymium iron boron • Properties: high coercive force, the maximum working temperature is up to 200°C • Grades: N35 to N52, 33M to 48M, 33H to 48H, 30SH to 45SH, 30UH to 38UH and 30EH to 35EH • Shapes and size: disc, block, ring and s
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
