New Equipment | Solder Materials
DKL Metals offer a range of flux cored solder wires in a variety of alloy specifications including SN100C (SnCuNi), E-Qual 97TSC (SAC305), E-Qual 96TSC (SAC387), Alloy 23 (SnCu) and Alloy 28 (SnAg). A selection of our more popular products are detail
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-1001 Capacity: 657 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acce
New Equipment | Board Handling - Storage
Eureka XDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-101 Capacity: 93 Liters Humidity Range: ≤5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 se
New Equipment | Education/Training
Second edition of the CD provides a guide to all aspects of wave soldering with all the common process defects. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained along with materials used and the changes n
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Wave Soldering
Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
