Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
RTPM (Real Time Temperature Profile Monitoring System) Option Set the optimum profile and checks if the set profile is maintained within the error range by measuring the temperature in the oven in real time. (alarm sounds when there is an error)
Video information, please check here: https://www.youtube.com/channel/UCsvrvIqVYhXxYBQ7zhUqDYw NeoDen4, the brand new and long awaited model of NeoDen, is a desktop Pick andPlace machine with vision system. As a professional PnP machine design
NeoDen4, the brand new and long-awaited model of NeoDen, is a desktop Pick andPlace machine with vision system. NeoDen4 is with dual cameras, auto rails, auto electronic feeders and 4 placement heads, which could help to handle 0201, BGA, QFN and 0
Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D
Middle speed multiple-function visual mounter Type：T6S T6S Features： 1、High speed：Typical speed can up to;12000-14000cph. Theoretical Max mount speed can up to:9000-11000CPH。 2.Mounter head quantity：12 3、Integra
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
winsouce.jpg)
.gif)
