New Equipment | Cleaning Equipment
Fully automatic online PCBA cleaning machine-SMS-6300 SMS6300 is an online, integrated, fully automatic PCBA cleaning machine, used for rosin flux, no-cleaning flux, water-soluble flux, solder paste and other organic and inorganic pollution remainin
New Equipment | Cleaning Equipment
The Electrovert Aquastorm is a versatile, high performance cleaning system designed to optimize the PCB cleaning process while minimizing overall cost. The Aquastorm features the most advanced cleaning technologies in an energy-efficient design
New Equipment | Cleaning Equipment
Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum downtime all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. As high-reliability PCBs become minia
New Equipment | Cleaning Equipment
Matching Fooprint to Application The Aquastorm 60 in-line cleaning system is ideal for PCB, semiconductor, and industrial cleaning type applications in which the manufacturing volume has outgrown the capability of a batch type cleaner and/or lack th
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Solder Materials
Having the right soldering supplies on hand for any project is vital to your work. When you are in the market for new supplies like thinner and liquid soldering flux, you can find an array of such products on our website. Depending on what you need a
New Equipment | Solder Materials
An alcohol based, halide free, no-clean liquid flux designed specifically to have a very wide process window for wave solder applications.Flux, No Clean Liquid, NC-264-5, (4 Gallon Case)
New Equipment | Wave Soldering
Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
New Equipment | Solder Materials
We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications. We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liquid Fluxes have been a
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