New SMT Equipment: non conductive epoxy (Page 1 of 11)

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

DV-7000 Heli-Flow Pump

DV-7000 Heli-Flow Pump

New Equipment | Dispensing

The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,

ASYMTEK Products | Nordson Electronics Solutions

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa

ASYMTEK Products | Nordson Electronics Solutions

PCB & Semiconductor Packaging Materials.

PCB & Semiconductor Packaging Materials.

New Equipment | Materials

Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian

i3 Electronics

Conductile

Conductile

New Equipment |  

VPI Solid Vinyl ESD control tile and conductive epoxy adhesive are components of a precision-engineered system of static control tile. Conductile (static-conductive) vinyl tile contains encapsulated conductive elements of the carbon family that are

VPI, LLC

Statmate

Statmate

New Equipment |  

VPI ESD control vinyl tile and conductive epoxy adhesive are components of a precision-engineered system of static control tile. Statmate (static-dissipative) vinyl tile contains encapsulated conductive elements of the carbon family that are distrib

VPI, LLC

Surface Mount Epoxy 4089

Surface Mount Epoxy 4089

New Equipment | Dispensing

Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, 

AIM Solder

EP-900 Two-part Silver Stencil Epoxy For Stencil Printing

EP-900 Two-part Silver Stencil Epoxy For Stencil Printing

New Equipment | Materials

4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

New Equipment | Materials

EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle

Conductive Compounds, Inc.

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non conductive epoxy searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Conductive Adhesive & Non-Conductive Adhesive Dispensing

Software for SMT placement & AOI - Free Download.
High Throughput Reflow Oven

Best Reflow Oven
Win Source Online Electronic parts

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