The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's PullTester 26 is a dual-range, motorized benchtop device designed to measure pull forces of wire crimp connections as well as ultrasonic metal welding connections on a wider range of wire than single-range pull test devices.
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's PullTester 28 is a dual-range, motorized benchtop device designed to measure pull forces of wire crimp connections as well as ultrasonic metal welding connections on a wider range of wire than single-range pull test devices.
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive
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