MICROFOCUS X-RAY 3D/CT SYSTEM VX-9100 The VX-9100 3D X-Ray Inspection Machine is a state-of-the-art industrial microfocus CT system designed for precise quality inspection and non-destructive analysis of electronic components. Its advanced cap
The RTI-7500 is CR Technology's its most progressive inline high-speed vision inspection system to date. The RTI-7500 sets a new industry standard with its advanced color image processing Mega-pixel cameras, exceptional precision, and high-speed insp
Non-destructive infrared inspection system for circuit card assemblies. Uses high resolution infrared radiometers with WindowsNT software for image analysis.
The Photon Dynamics Superior X-ray (SX) Series provides users with a high-resolution and high magnification X-ray inspection capability in a flexible, compact workstation configuration. With its wide selection of X-ray sources, image intensifiers, sa
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive
X-eye 5100 Series Entry-level X-ray Inspection System Practical X-ray Inspection System 100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained. Customer convenience is pri
Fast automatic inspection and high performance sample testing in one system. Two inspection concepts in one system - The best of two worlds. In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors a
State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
Fast Automatic X-ray Measurement of TSVs, MEMS and Wafer Bumps for Voiding, Fill Level, Overlay & Other Critical Dimensions. Measuring the Invisible™ This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
